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J-GLOBAL ID:201102225358549138   Reference number:11A1502240

Creep Characteristics of Electrolytic Copper Thin Films

銅めっき薄膜のクリープ特性に関する研究
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Volume: 60  Issue:Page: 831-837 (J-STAGE)  Publication year: 2011 
JST Material Number: F0385A  ISSN: 0514-5163  CODEN: ZARYA  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Electroplating  ,  Metallic materials 
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