Art
J-GLOBAL ID：201202209775150665   Reference number：12A0239137

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Sn-Ag-Cu微小はんだ接合の疲れ延性指数に対する周期性歪硬化指数の影響
Author (3)：
KANDA Yoshihiko

About KANDA Yoshihiko

(Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN)

About Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN

, 
KARIYA Yoshiharu

About KARIYA Yoshiharu

(Shibaura Inst. of Technol., Dep. of Materials Sci. and Engineering, 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN)

About Shibaura Inst. of Technol., Dep. of Materials Sci. and Engineering, 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN

, 
OTO Yuji

About OTO Yuji

(Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN)

About Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, 135-8548, Tokyo, JPN


Material：
Journal of Electronic Materials  (J Electron Mater)

About Journal of Electronic Materials


Volume： 41  Issue： 3  Page： 580-587  Publication year： Mar. 2012 
JST Material Number： D0277B  ISSN： 0361-5235  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
solder

About solder

, 
*fatigue fracture

About fatigue fracture

, 
*strain hardening

About strain hardening

, 
n value (work hardening)

About n value (work hardening)

, 
soldering

About soldering

, 
retention time

About retention time

, 
intermetallic compound

About intermetallic compound

, 
grain boundary fracture

About grain boundary fracture

, 
*Pb free solder

About Pb free solder

, 
index number

About index number


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
soldering

About soldering

, 
*Pb free solder

About Pb free solder

, 
intergranular fracture

About intergranular fracture

, 
strain hardening exponent

About strain hardening exponent


JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Electric and electronic parts in general 
(NA05010H)

About Electric and electronic parts in general

Terms in the title (8)：
Terms in the title
Keywords automatically extracted from the title.
Sn-Ag-Cu

About Sn-Ag-Cu

, 
微小

About 微小

, 
はんだ接合

About はんだ接合

, 
疲れ

About 疲れ

, 
延性

About 延性

, 
指数

About 指数

, 
周期性

About 周期性

, 
歪硬化指数

About 歪硬化指数


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