Art
J-GLOBAL ID：201202228321619000   Reference number：12A0835040

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

多温度応力緩和試験によるSn-Ag-Cuマイクロはんだ接合のクリープ特性の評価
Author (2)：
KANDA Yoshihiko

About KANDA Yoshihiko

(Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, JPN)

About Graduate School of Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, JPN

, 
KARIYA Yoshiharu

About KARIYA Yoshiharu

(Dep. of Materials Sci. and Engineering, Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, JPN)

About Dep. of Materials Sci. and Engineering, Shibaura Inst. of Technol., 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, JPN


Material：
Microelectronics Reliability  (Microelectronics and Reliability)

About Microelectronics Reliability


Volume： 52  Issue： 7  Page： 1435-1440  Publication year： Jul. 2012 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*relaxation test

About relaxation test

, 
*soldering

About soldering

, 
*tin base alloy

About tin base alloy

, 
silver containing alloy

About silver containing alloy

, 
copper containing alloy

About copper containing alloy

, 
*creep

About creep

, 
*IC package

About IC package

, 
LSI

About LSI

, 
stress indices

About stress indices

, 
activation energy

About activation energy

, 
micro structure

About micro structure

, 
relaxation time

About relaxation time

, 
strain rate

About strain rate

, 
numerical analysis

About numerical analysis

, 
bump

About bump

, 
micro soldering

About micro soldering

, 
*mechanical property

About mechanical property


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
SAC

About SAC

, 
solder ball

About solder ball


JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
応力緩和試験

About 応力緩和試験

, 
Sn-Ag-Cu

About Sn-Ag-Cu

, 
マイクロ

About マイクロ

, 
はんだ接合

About はんだ接合

, 
クリープ特性

About クリープ特性

, 
評価

About 評価


Return to Previous Page

TOP

BOTTOM