Bondability of Copper Wires onto a Laser-Sintered Silver Pad

YAMASAKI Kazuhiko; TAKAHASHI Sumihiro; MITA Mamoru; MAEKAWA Katsuhiro

Art

J-GLOBAL ID：201202271297934377 Reference number：12A0757329

Bondability of Copper Wires onto a Laser-Sintered Silver Pad

レーザシンター銀パッドに対する銅配線の接着性

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Material：
Volume： 2012 Page： ROMBUNNO.TB2-2 Publication year： Apr. 17, 2012
JST Material Number： L6010B Document type： Proceedings
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Printed circuits , Manufacturing technology of solid-state devices

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