Art
J-GLOBAL ID:201202271297934377   Reference number:12A0757329

Bondability of Copper Wires onto a Laser-Sintered Silver Pad

レーザシンター銀パッドに対する銅配線の接着性
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Volume: 2012  Page: ROMBUNNO.TB2-2  Publication year: Apr. 17, 2012 
JST Material Number: L6010B  Document type: Proceedings
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Printed circuits  ,  Manufacturing technology of solid-state devices 
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