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J-GLOBAL ID:201402211396706051   Reference number:14A0769737

Magnetic Field Effects on Copper Metal Deposition from Copper Sulfate Aqueous Solution

硫酸銅水溶液から銅金属析出に及ぼす磁場効果
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Material:
Volume: 118  Issue: 18  Page: 4889-4894  Publication year: May. 08, 2014 
JST Material Number: W0921A  ISSN: 1520-6106  CODEN: JPCBFK  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Metallic thin films  ,  Electroless plating 
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