Art

J-GLOBAL ID：201402258648024400   Reference number：14A0622756

Surface roughening and rippling during plasma etching of silicon: Numerical investigations and a comparison with experiments

シリコンのプラズマエッチング過程での表面粗化とリップル形成:数値的研究と実験との比較

Author (5)： TSUDA Hirotaka (Dep. of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto Univ., Kyoto-daigaku Katsura ...) ,  NAKAZAKI Nobuya (Dep. of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto Univ., Kyoto-daigaku Katsura ...) ,  TAKAO Yoshinori (Dep. of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto Univ., Kyoto-daigaku Katsura ...) ,  ERIGUCHI Koji (Dep. of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto Univ., Kyoto-daigaku Katsura ...) ,  ONO Kouichi (Dep. of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto Univ., Kyoto-daigaku Katsura ...)
Material： Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena  (Journal of Vacuum Science & Technology. B. Nanotechnology & Microelectronics: Materials, Processing, Measurement, & Phenomena)
Volume： 32  Issue： 3  Page： 031212-031212-21  Publication year： May. 2014 
JST Material Number： E0974A  ISSN： 2166-2746  CODEN： JVTBD9  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Thesaurus term： *silicon ,  *plasma etching ,  chlorine ,  oxygen ,  surface treatment ,  *Monte Carlo method ,  computer simulation ,  three dimension ,  *surface roughness ,  waveform ,  sputtering ,  oxidation ,  *semiconductor ,  surface structure
Semi thesaurus term： surface roughening

JST classification (3)： Manufacturing technology of solid-state devices  (NC03030V) ,  Applications of plasma  (BJ02110K) ,  Surface structure of semiconductors  (BK15030A)

Terms in the title (7)： シリコン ,  プラズマエッチング ,  過程 ,  表面粗化 ,  数値 ,  研究 ,  実験