Rchr
J-GLOBAL ID：201501057217310927
Update date: Apr. 23, 2024
nobuyuki shishido
シシド ノブユキ | nobuyuki shishido
Affiliation and department：
Research field (1)：
Machine materials and mechanics
Research keywords (4)：
電子実装
, 信頼性設計
, 破壊力学
, 材料力学
Research theme for competitive and other funds (4)：
- 2019 - 2022 Development of evaluation and control method for local fluctuation of thermal characteristics near lattice defects
- 2018 - 2021 Detection of potential defects on small-scale interfacial structures
- 2015 - 2017 Qualitative evaluation for the diversity of interface strength due to fcc crystalline structure
- 2013 - 2015 Evaluation for distribution of interface strength induced by grain structure
Papers (21)：
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Kazunori Hasegawa, Kanta Hara, Nobuyuki Shishido, Satoshi Nakano, Wataru Saito, Tamotsu Ninomiya. Power-cycling degradation monitoring of an IGBT module with VCE(sat) measurement in continuous operation of a chopper circuit. Power Electronic Devices and Components. 2024. 7
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Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato, Toru Ikeda, Yutaka Hayama, Seiya Hagihara, Noriyuki Miyazaki. Proposal of Evaluation Method for Wire-Liftoff Lifetime of Power Modules Using Cyclic 4-Point-Bending Fatigue Test. Journal of The Japan Institute of Electronics Packaging. 2022. 25. 3. 260-268
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Daizen Nakamura, Naoto Koshizaki, Nobuyuki Shishido, Shoji Kamiya, Yoshie Ishikawa. Fracture and embedment behavior of brittle submicrometer spherical particles fabricated by pulsed laser melting in liquid using a scanning electron microscope nanoindenter. Nanomaterials. 2021. 11. 9
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Koji Hidaka, Masaaki Koganemaru, Tomohito Sekine, Nobuyuki Shishido, Shoji Kamiya, Takeo Minari, Toru Ikeda, Shizuo Tokito. Evaluation of leakage current and leakage path of gate-insulating layer used in organic thin-film transistors under mechanical loading. Journal of Japan Institute of Electronics Packaging. 2021. 24. 6. 586-594
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Nobuyuki Shishido, Yoshiki Setoguchi, Yuto Kumagai, Masaaki Koganemaru, Toru Ikeda, Yutaka Hayama, Noriyuki Miyazaki. Characterization of plastic and creep behavior in thick aluminum wire for power modules. MICROELECTRONICS RELIABILITY. 2021. 123
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MISC (131)：
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Noriyuki Miyazaki, Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Yutaka Hayama, Seiya Hagihara. Discussion on the test methodologies for structural integrity of power module. Journal of Japan Institute of Electronics Packaging. 2021. 24. 6. 560-571
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Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama. Review of Methodologies for Structural Integrity Evaluation of Power Modules. JOURNAL OF ELECTRONIC PACKAGING. 2021. 143. 2
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HAYAMA Yutaka, SHISHIDO Nobuyuki, HAGIHARA Seiya, MIYAZAKI Noriyuki. Application of Creep Multi-linear Rule to ORNL Modified Strain Hardening of Al Wire Bonding in Power Module. The Proceedings of The Computational Mechanics Conference. 2021. 2021.34. 109
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Evaluation of Insulation Capability of Gate-Insulating Layer for Organic Thin-Film Transistors Under Mechanical Loading. Proceedings of Microelectronics Symposium. 2020. 30. 95-98
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漆原 誠, 宍戸 信之, 神谷 庄司. 電着被覆による銅-ポリアミドイミド界面の密着性改善. エレクトロニクス実装学術講演大会講演論文集. 2020. 34. 5D2-01
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Patents (5)：
Professional career (1)：
Work history (6)：
Awards (4)：
- 2017/02 - スマートプロセス学会 Mate2017奨励賞 パワーモジュール用アルミワイヤボンディングの熱疲労信頼性に対する材料非線形の効果
- 2016/12 - 日本機械学会マイクロ・ナノ工学部門 優秀講演論文賞 微小な単結晶銅ねじり試験における初期降伏の寸法効果
- 2009/09 - エレクトロニクス実装学会 MES2008ベストペーパー賞 デジタル画像相関法を用いたレーザ顕微鏡観察による回路基板内部のひずみ分布計測手法
- 2007/02 - 溶接学会 Mate2006優秀論文賞 デジタルイメージ相関法を用いた微細実装接合部のひずみ計測
Association Membership(s) (3)：
Microscopy Society of America
, American Society of Mechanical Engineers
, THE JAPAN SOCIETY OF MECHANICAL ENGINEERS
