Art

J-GLOBAL ID：201602225217496923   Reference number：16A0689566

Correlation between microstructure and mechanical properties of Sn-Bi-X solders

Sn-Bi-Xはんだのミクロ組織と機械的性質間の関連

Author (2)： Mokhtari Omid (Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan) ,  Nishikawa Hiroshi (Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan)
Material： Materials Science & Engineering. A. Structural Materials: Properties, Microstructure and Processing  (Mater Sci Eng A Struct Mater Prop Microstruct Process)
Volume： 651  Page： 831-839  Publication year： Jan. 10, 2016 
JST Material Number： D0589B  ISSN： 0921-5093  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Thesaurus term： *tin base alloy ,  bismuth containing alloy ,  *solder ,  indium containing alloy ,  nickel containing alloy ,  eutectic alloy ,  copper ,  joint(tool) ,  fractography ,  shear strength ,  shearing test ,  elongation percentage ,  tensile strength ,  substrate(plate) ,  interface(surface) ,  intermetallic compound ,  reflow soldering ,  aging(phenomenon) ,  fracture surface ,  metal structure(microstructure)
Semi thesaurus term： solder joint ,  Pb free solder ,  thermal aging

Author keywords (6)： Sn-Bi ,  Shear test ,  Tensile test ,  Bi coarsening ,  Lead-free solder ,  Intermetallic compounds

JST classification (3)： Mechanical properties  (WB02030U) ,  Transformation structures,work structures  (WB01030N) ,  Brazing  (WC07050C)

Terms in the title (5)： Sn ,  Bi ,  はんだ ,  ミクロ組織 ,  機械的性質