Art

J-GLOBAL ID：201602240503416370   Reference number：16A0835559

Forming long Ag thin wires by using stress migration

応力移動を用いて長いAg細線を生成

Author (4)： Lu Yebo (College of Mechanical and Electrical Engineering, Jiaxing University, 118 Jiahang Road, Jiaxing 314001, PR China) ,  Lu Yebo (Department of Nanomechanics, Tohoku University, Aoba 6-6-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan) ,  Li Yuan (Department of Nanomechanics, Tohoku University, Aoba 6-6-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan) ,  Saka Masumi (Department of Nanomechanics, Tohoku University, Aoba 6-6-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan)
Material： Materials Letters  (Mater Lett)
Volume： 171  Page： 72-74  Publication year： May. 15, 2016 
JST Material Number： E0935A  ISSN： 0167-577X  Document type： Article
Article type： 短報  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Thesaurus term： *migration (chemical material) ,  *Silver ,  *fine line ,  multilayer film ,  copper foil ,  sputtered deposition ,  evaporated film ,  Titanium ,  layer ,  titanium compound ,  nitride ,  compressive stress ,  Diffusion ,  atom ,  tensile stress ,  crack initiation ,  brittle fracture ,  crack propagation ,  protective film ,  transference electrode ,  flexibility ,  integrated circuit ,  electromagnetic equipment ,  atomic diffusion ,  titanium nitride ,  *stress migration
Semi thesaurus term： barrier layer ,  *stress migration

Author keywords (5)： Silver ,  Thin wires ,  Stress migration ,  Thin films ,  Multilayer structure

JST classification (2)： Techniques and equipment of thin film deposition  (BK14020I) ,  Other metallography  (WB01040Y)

Terms in the title (3)： 応力 ,  Ag ,  細線