Art

J-GLOBAL ID：201602248113458726   Reference number：16A1272126

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

繰返し熱サイクル下の高温ダイボンディングのための銀ナノ多孔質接合継手の信頼性

Author (6)： Kim Min-Su (Joining and Welding Research Institute, Osaka University) ,  Kim Min-Su (Graduate School of Engineering, Osaka University) ,  Matsunaga Kaori (Graduate School of Engineering, Osaka University) ,  Ko Yong-Ho (Micro-Joining Center, Korea Institute of Industrial Technology) ,  Lee Chang-Woo (Micro-Joining Center, Korea Institute of Industrial Technology) ,  Nishikawa Hiroshi (Joining and Welding Research Institute, Osaka University)
Material： Materials Transactions  (Mater Trans)
Volume： 57  Issue： 7  Page： 1192-1196(J-STAGE)  Publication year： 2016 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *die bonding ,  heat cycle ,  *nano particle ,  *porous metal ,  joint (tool) ,  reliability (property) ,  *bond strength ,  semiconductor chip ,  shear strength ,  thermal stability ,  *brazing joint ,  silicon ,  nanostructure ,  membrane and film ,  silicon nitride ,  Copper ,  substrate (plate) ,  activity (property) ,  nanosheet ,  *solder joint ,  *long term reliability ,  *silver nanoparticle ,  mechanical property ,  strength
Semi thesaurus term： Si chip ,  *nanosilver ,  活性ろう付

Author keywords (5)： silver nanoporous ,  die attach ,  high temperature ,  temperature cycling ,  fracture

JST classification (2)： Brazing  (WC07050C) ,  Manufacturing technology of solid-state devices  (NC03030V)

Reference (16)：

• 1) K. Zeng and K.N. Tu: Mater. Sci. Eng. R. 38 (2002) 55. 10.1016/S0927-796X(02)00007-4
• 2) Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment: Official Journal of the European Union 46 (2003) L 37/19.
• 3) Directive 2011/95/EC of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (recast): Official Journal of the European Union, 54 (2011) L 174/88.
• 4) V. Chidambaram, J. Hald and J. Hattel: J. Alloy. Compd. 490 (2010) 170. 10.1016/j.jallcom.2009.10.108
• 5) Y. Shi, W. Fang, Z. Xia, Y. Lei, F. Guo and X. Li: J. Mater. Sci. Mater. Electron. 21 (2010) 875. 10.1007/s10854-009-0010-5

Terms in the title (5)： 熱サイクル ,  ダイボンディング ,  銀 ,  ナノ多孔質 ,  接合継手