Art

J-GLOBAL ID：201702248060081857   Reference number：17A0470076

Review of silver nanoparticle based die attach materials for high power/temperature applications

高出力/温度応用のための銀ナノ粒子に基づくダイアタッチ材料のレビュー【Powered by NICT】

Author (2)： Paknejad Seyed Amir (King’s College London, Physics Department, Strand, London WC2R 2LS, UK) ,  Mannan Samjid H. (King’s College London, Physics Department, Strand, London WC2R 2LS, UK)
Material： Microelectronics Reliability  (Microelectronics and Reliability)
Volume： 70  Page： 1-11  Publication year： 2017 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Abstract/Point： There has been a significant r...

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Thesaurus term： particle size (diameter) ,  particle size distribution ,  *nano particle ,  organic compound ,  *die bonding ,  *Silver ,  paste ,  metallization (IC) ,  thermal resistance ,  thermal degradation ,  sintering ,  sintering temperature ,  *silver nanoparticle ,  *high power output

Author keywords (6)： Sintered silver ,  Harsh environment ,  Nanosilver ,  Die-attach ,  Electronic packaging ,  Low temperature joining technique

JST classification (2)： Measurement,testing and reliability of solid-state devices  (NC03040G) ,  Materials of solid-state devices  (NC03020K)

Terms in the title (5)： 高出力 ,  応用 ,  銀ナノ粒子 ,  ダイアタッチ材 ,  レビュー