Art

J-GLOBAL ID：201702251936030089   Reference number：17A1943619

High Performance Virtual Channel Based Fully Adaptive 3D NoC Routing for Congestion and Thermal Problem

輻輳および熱問題に対する高性能バーチャルチャネルベースの完全適応型3D NoCルーティング

Author (4)： JIANG Xin (Faculty of Graduate School of Information, Production & Systems, Waseda University) ,  LEI Xiangyang (Faculty of Graduate School of Information, Production & Systems, Waseda University) ,  ZENG Lian (Faculty of Graduate School of Information, Production & Systems, Waseda University) ,  WATANABE Takahiro (Faculty of Graduate School of Information, Production & Systems, Waseda University)
Material： IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences (Web)  (IEICE Trans Fundam Electron Commun Comput Sci (Web))
Volume： E100.A  Issue： 11  Page： 2379-2391(J-STAGE)  Publication year： 2017 
JST Material Number： U0466A  ISSN： 1745-1337  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *VLSI ,  congestion control ,  heat generation, pyrexia ,  communication channel ,  *algorithm ,  routing ,  communication operation ,  adaptation
Semi thesaurus term： *NoC ,  network congestion ,  virtual channel ,  *routing algorithm ,  adaptive routing

Author keywords (4)： thermal-aware ,  routing algorithm ,  fully adaptive ,  3D NoC

JST classification (2)： Semiconductor integrated circuit  (NC03162T) ,  Communication network  (ND07030A)

Reference (26)：

• [1] W. Dally and B. Towles, Principles and Practices of Interconnection Networks, Morgan Kaufmann Publishers Inc., San Francisco, 2003. 10.1016/b978-155860852-8/50001-8
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• [3] N. Dahir, G. Tarawneh, T. Mak, R. Al-Dujaily, and A. Yakovlev, “Design and implementation of dynamic thermal-adaptive routing strategy for networks-on-chip,” Parallel, Distributed and Network-Based Processing (PDP), 2014 22nd Euromicro International Conference on. IEEE, pp.384-391, 2014. 10.1109/pdp.2014.70
• [4] C.H. Chao, “Traffic- and thermal-aware run-time thermal management scheme for 3D NoC Systems,” Proc. NOCS, pp.223-230, 2010. 10.1109/nocs.2010.32
• [5] L. Shang, L. Peh, A. Kumar, and N.K. Jha, “Thermal modeling, characterization and management of on-chip networks,” Proc. 37th annual IEEE/ACM International Symposium on Microarchitecture, pp.67-78, Dec. 2004. 10.1109/micro.2004.35

Terms in the title (6)： 輻輳 ,  高性能 ,  バーチャルチャネル ,  3D ,  NoC ,  ルーティング