Art

J-GLOBAL ID：201802232159336561   Reference number：18A1500224

Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength

はんだ接合強度に及ぼす無電解ニッケルめっきの内部応力の影響

Author (4)： MIYAMA Katsumi (Hokkaido Univ. Sci., Hokkaido, JPN) ,  YOSHIDA Kanou (Hokkaido Univ. Sci., Hokkaido, JPN) ,  SAITOU Shigeru (Hokkaido Univ. Sci., Hokkaido, JPN) ,  TAKASHIMA Toshiyuki (Hokkaido Univ. Sci., Hokkaido, JPN)
Material： Transactions of the Japan Institute of Electronics Packaging (Web)  (Trans Jpn Inst Electron Packag (Web))
Volume： 8  Issue： 1  Page： 1-7(J-STAGE)  Publication year： 2015 
JST Material Number： U0592A  ISSN： 1884-8028  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *soldering ,  *bond strength ,  *nickel plating ,  *internal stress ,  evaluation ,  printed board ,  bump ,  shearing test ,  *local corrosion ,  shear strength ,  gold plating ,  pH ,  X-Ray Diffraction ,  scanning electron microscope ,  energy dispersive X-ray spectrometry ,  *electroless nickel plating ,  field emission scanning electron microscope ,  *Corrosion ,  mechanical property ,  strength
Semi thesaurus term： energy dispersive X-ray spectrometry ,  FE-SEM ,  solder ball ,  impact assessment ,  bond strength

JST classification (1)： Connecting parts  (NA05050Z)

Reference (7)：

• [1] K. Tajima, "ENEPIG as Final Finish Plation on Printed Wiring Board and Package Substrate," J. Surf. Finish. Soc. Jpn, Vol. 62, No. 8, pp. 387-391, 2011.
• [2] Y. Ejiri, T. Sakurai, Y. Arayama, K. Suzuki, Y. Tsubomatsu, S. Hatakeyama, et al., "Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (I) - Influence of the Electroless Ni Plating Thickness on the Solder Ball Joining Reliability -," The Journal of The Japan Institute of Electronics Packaging, Vol. 15, No. 1, pp. 82-95, 2012.
• [3] K. Iwamatsu, K. Otsuka, and K. Naito, "The internal stress of Electroless Deposits," J. Surf. Finish. Soc. Jpn, Vol. 43, No. 7, pp. 656-666, 1992.
• [4] B. Stein, "Fast and Accurate Deposit Internal Stress Determinartion," Proc. AESF Electroforming Symposium, 1996.
• [5] G. Richardson and B. Stein, "Comparative Study of Three Internal Stress Measurement Methods," AESF Electroforming Symposium, 1997.

Terms in the title (3)： はんだ接合 ,  無電解ニッケルめっき ,  内部応力