Art

J-GLOBAL ID：201902225516769772   Reference number：19A1303583

High Thermal Conductivity Epoxy Resins with Rigid Chemical Structure

剛直構造によるエポキシ樹脂の高熱伝導化

Author (1)： HARADA MIYUKI (関西大学化学生命工学部化学・物質工学科)
Material： エレクトロニクス実装学会誌  (Journal of Japan Institute of Electronics Packaging)
Volume： 22  Issue： 3  Page： 199-204(J-STAGE)  Publication year： 2019 
JST Material Number： S0579C  ISSN： 1343-9677  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *epoxy resin ,  *heat conduction ,  *rigid-rod polymer ,  electronic component ,  adhesive force ,  requirement specification ,  power electronics ,  mesogen

JST classification (1)： Measuring methods and instruments of other thermal variables  (AD06040R)

Reference (31)：

• 1) エポキシ樹脂技術協会:総説エポキシ樹脂 基礎編I・II,エポキシ樹脂技術協会,2003
• 2) A. Shiota and C. Ober: "Analysis of Smectic Structure Formation in Liquid Crystalline Thermosets," Polymer, Vol. 38, pp. 5857-5867, 1997
• 3) W. Mormann, M. Brocher, and P. Schwarz: "Mesogenic Azomethine Based Diepoxides-Monomers for the Synthesis of "Liquid Crystal" Thermoset Networks," Macromol. Chem. Phys., Vol. 198, pp. 3615-3626, 1997
• 4) W. Liu and C. Carfagna: "Synthesis of Liquid Crystalline Epoxy Oligomers: Effect of Molecular Weight on the Phase Behavior," Macromol. Rapid Commun., Vol. 22, pp. 1058-1062, 2001
• 5) H. Sue, J. Earls, et al.: "Fracture Behavior of Liquid Crystal Epoxy Resin Systems Based on Diglycidyl Ether of 4, 4'-Dihydroxy-a -methylstilbene: Part II Effect Due to Blending with TACTIX 556 Epoxy Resin and Phenolic Monomers," J. Mater. Sci., Vol. 32, pp. 4039-4046, 1997

Terms in the title (2)： エポキシ樹脂 ,  熱伝導