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J-GLOBAL ID:201902241352659951   Reference number:19A2689638

Visualization of Stress Distribution by Photoelastic Method Under Ultrasonic Grinding Condition

超音波研削条件下での光弾性法による応力分布の可視化
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Volume: 13  Issue:Page: 736-742  Publication year: Nov. 05, 2019 
JST Material Number: L0997B  ISSN: 1881-7629  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Grinding 
Reference (23):
  • [1] J. Ishimatsu, A. Iwaita, and H. Isobe, “Grinding a hard-to-grind materials with ultrasonic-assisted fluid,” Int. J. Automation Tech., Vol.8, No.3, pp. 478-483, 2014.
  • [2] K. Hara, H. Isobe, and A. Kyusojin, “Effects of cutting edge truncation on ultrasonically assisted grinding,” Key Engineering Material, Vols.389-390, pp. 368-374, 2008.
  • [3] K. Noma, Y. Takeda, Y. Kakinuma, T. Aoyama, and S. Hamada, “A study on processing characteristics of chemically strengthened glass using ultrasonic vibration assisted helical milling,” 2014 Spring Meeting of JSPE, p. 103, 2014.
  • [4] G. F. Gao, B. Zhao, F. Jiao, and C. S. Liu, “Research on the characteristics of the cutting force in the vibration cutting of a particle-reinforced metal matrix composites SiCp/Al,” J. Mater. Process. Tech., Vol.129, Nos.1-3, pp. 96-199, 2002.
  • [5] R. Mumhammad, A. Maurotto, A Roy, and V. Silberschmidt, “Hot ultrasonically assisted turning of β-Ti alloy,” Procedia CIRP, Vol.1, pp. 336-341, 2012.
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