Art

J-GLOBAL ID：201902249483486508   Reference number：19A1771434

Demonstration of +100-GHz Interconnects in eWLB Packaging Technology

EWLBパッケージング技術における+100GHz相互接続の実証【JST・京大機械翻訳】

Author (7)： Hassona Ahmed (Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden) ,  He Zhongxia Simon (Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden) ,  Vassilev Vessen (Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden) ,  Mariotti Chiara (Infineon Technologies Austria AG, Villach, Austria) ,  Gunnarsson Sten E. (Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden) ,  Dielacher Franz (Infineon Technologies Austria AG, Villach, Austria) ,  Zirath Herbert (Department of Microtechnology and Nanoscience-MC2, Chalmers University of Technology, Goeteborg, Sweden)
Material： IEEE Transactions on Components, Packaging, and Manufacturing Technology  (IEEE Trans Compon Packag Manuf Technol)
Volume： 9  Issue： 7  Page： 1406-1414  Publication year： 2019 
JST Material Number： W0590B  ISSN： 2156-3950  CODEN： ITCPC8  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： This paper presents waveguide ...

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Thesaurus term： insertion loss ,  waveguide ,  commercialization ,  mass production ,  bandwidth ,  *interconnection ,  redistribution ,  *packaging technology
Semi thesaurus term： 費用対効果 ,  BGAパッケージ ,  RF信号 ,  Dバンド ,  実装技術 , 【Automatic Indexing@JST】

JST classification (2)： Connecting parts  (NA05050Z) ,  Printed circuits  (NA05040O)

Terms in the title (3)： パッケージング技術 ,  相互接続 ,  実証