Art

J-GLOBAL ID：201902281419386817   Reference number：19A1042522

Modeling simplification for thermal mechanical stress analysis of TSV interposer stack

TSVインターポーザスタックの熱機械的応力解析のための単純化モデリング【JST・京大機械翻訳】

Author (4)： Xia Kequan (Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province Ocean College, Zhejiang University, Zhejiang Province 316021, PR China) ,  Zhu Zhiyuan (Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province Ocean College, Zhejiang University, Zhejiang Province 316021, PR China) ,  Zhang Hongze (Nanjing Electronic Devices Institute, Jiangsu Province 210016, PR China) ,  Xu Zhiwei (Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province Ocean College, Zhejiang University, Zhejiang Province 316021, PR China)
Material： Microelectronics Reliability  (Microelectronics and Reliability)
Volume： 96  Page： 46-50  Publication year： 2019 
JST Material Number： C0530A  ISSN： 0026-2714  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Abstract/Point： The generalized plane deformat...

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Thesaurus term： doping ,  boundary condition ,  three dimension ,  *modeling ,  polysilicon ,  optimization ,  silicon ,  *simplification ,  thermal stress analysis ,  model
Semi thesaurus term： 機械的ストレス ,  *インターポーザ , 【Automatic Indexing@JST】

Author keywords (3)： Three dimensional integration ,  Generalized plane deformation (GPD) mode ,  Through silicon via (TSV)

JST classification (2)： Manufacturing technology of solid-state devices  (NC03030V) ,  Measurement,testing and reliability of solid-state devices  (NC03040G)

Terms in the title (7)： TSV ,  インターポーザ ,  スタック ,  機械的応力 ,  解析 ,  単純化 ,  モデリング