Art

J-GLOBAL ID：202002213772266260   Reference number：20A1353028

Hybrid Molecular Junctions Using Au-S and Au-π Bindings

Au-SおよびAu-π結合を用いたハイブリッド分子接合【JST・京大機械翻訳】

Author (7)： Fujii Shintaro (Department of Chemistry, Graduate School of Science and Engineering, Tokyo Institute of Technology, Japan) ,  Iwane Madoka (Department of Chemistry, Graduate School of Science and Engineering, Tokyo Institute of Technology, Japan) ,  Furukawa Shunsuke (Department of Chemistry, Graduate School of Science and Engineering, Saitama University, Saitama, Japan) ,  Tada Tomofumi (Materials Research Center for Element Strategy, Tokyo Institute of Technology, Japan) ,  Nishino Tomoaki (Department of Chemistry, Graduate School of Science and Engineering, Tokyo Institute of Technology, Japan) ,  Saito Masaichi (Department of Chemistry, Graduate School of Science and Engineering, Saitama University, Saitama, Japan) ,  Kiguchi Manabu (Department of Chemistry, Graduate School of Science and Engineering, Tokyo Institute of Technology, Japan)
Material： Journal of Physical Chemistry C  (Journal of Physical Chemistry C. Energy Conversion and Storage, Optical and Electronic Devices, Interfaces, Nanomaterials, and Hard Matter)
Volume： 124  Issue： 17  Page： 9261-9268  Publication year： 2020 
JST Material Number： W1877A  ISSN： 1932-7447  CODEN： JPCCCK  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： Electrically conductive molecu...

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Thesaurus term： chemical bond ,  bonding and joining ,  electric conduction ,  *Gold ,  rupture ,  electronic circuit ,  sulfide (chalcogenide) ,  phosphine ,  molecular design ,  scanning tunneling microscope ,  conductance ,  conductive property ,  *pi-bond
Semi thesaurus term： *分子接合 ,  固定化 , 【Automatic Indexing@JST】

JST classification (3)： Electrochemistry in general  (CB07010N) ,  Other contacts  (BM03088W) ,  Metal-insulator-metal structures  (BM03087F)

Terms in the title (3)： Au ,  π結合 ,  分子接合