Art

J-GLOBAL ID：202002227388725709   Reference number：20A0467274

無加圧焼結されたAgナノ粒子の疲労き裂進展特性におよぼす時効の影響

Author (4)： OSAKI KOJI (芝浦工大 大学院) ,  KARIYA YOSHIHARU (芝浦工大 工) ,  MIZUMURA NORITSUKA (ナミックス) ,  SASAKI KOJI (ナミックス)
Material： Symposium on Microjoining and Assembly Technology in Electronics  (Proceedings of the Symposium on Microjoining and Assembly Technology in Electronics)
Volume： 26th  Page： 59-64  Publication year： Jan. 28, 2020 
JST Material Number： L2496A  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： circuit module ,  *die bonding ,  *Silver ,  paste ,  joint (part) ,  nano particle ,  fatigue crack growth ,  aging (phenomenon) ,  *sintered body ,  *fatigue life ,  crack growth rate ,  pressureless sintering ,  *object
Semi thesaurus term： power module ,  crack growth rate ,  silver paste ,  疲労き裂進展試験 ,  pressureless sintering

JST classification (2)： Manufacturing technology of solid-state devices  (NC03030V) ,  Materials of solid-state devices  (NC03020K)

Reference (10)：

• R. Kimura, et al.,“Effect of Sintering Temperature on Fatigue Crack Propagation Rate of Sintered Ag Nanoparticles”, Mater. Trans., Vol. 59, No. 4, (2018), pp. 614-618.
• R. Darveaux,“Effect of Simulation Methodology on Solder Joint Crack Growth Correlation”, Proc. of 50th Electronic Components & Technology Conference, Vol. 50, (2000), pp. 1048-1058.
• T. Sato, et al.,“Evaluation of Fatigue Crack Propagation Behavior of Pressurized Sintered Ag Nanoparticles amd Its Application to Thermal Fatigue Life Prediction of Sintered Joint”, Mater. Trans., Vol. 60, No. 6, (2019), pp. 850-857.
• A. Morozumi, et al.,“Reliability of Power Cycling for IGBT Power Semiconductor Modules”, IEE TRANSACTIONS ON INDUSTRY APPLICATIONS, Vol. 39, No. 3, (2003), pp. 665-671.
• 大谷隆一,北村隆行,“き裂伝ぱの破壊力学則より導かれた平滑材の高温疲労寿命則について”,材料,34巻382号(1985),pp.843-849.

Terms in the title (4)： 無加圧焼結 ,  Agナノ粒子 ,  疲労き裂進展 ,  時効