Art

J-GLOBAL ID：202002236172281980   Reference number：20A0230081

Self-Regulated Super-Hydrophobic Cu/CuO Electrode Film Deposited by One-Step High-Power Sputtering

一段高出力スパッタリングにより堆積した自己制御超疎水性Cu/CuO電極膜【JST・京大機械翻訳】

Author (15)： An Xiaokai (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Yang Chao (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Wu Zhongzhen (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Wu Zhongzhen (Department of Physics and Materials Science, City University of Hong Kong, Hong Kong, 999077, China) ,  Liu Liangliang (Department of Physics and Materials Science, City University of Hong Kong, Hong Kong, 999077, China) ,  Li Shunning (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Zhou Lin (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Tang Wei (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Ma Zhengyong (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Wu Zhongcan (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Fu Ricky K. Y. (Department of Physics and Materials Science, City University of Hong Kong, Hong Kong, 999077, China) ,  Tian Xiubo (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Lin Hai (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Pan Feng (School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen, 518055, China) ,  Chu Paul K. (Department of Physics and Materials Science, City University of Hong Kong, Hong Kong, 999077, China)
Material： Advanced Electronic Materials
Volume： 6  Issue： 1  Page： e1900891  Publication year： 2020 
JST Material Number： W2482A  ISSN： 2199-160X  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： In spite of advances in integr...

Register(free) or Log In to access     To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=20A0230081&from=J-GLOBAL&jstjournalNo=W2482A") }}

Thesaurus term： surface energy ,  salinity ,  ceramics ,  contact angle ,  nanorod ,  electronic component ,  corrosion resistance ,  dust ,  preferred orientation ,  *copper ,  metallization(IC) ,  arc discharge ,  metal wire ,  microelectronics ,  *cupric oxide

Author keywords (4)： corrosion resistance ,  Cu/CuO electrodes ,  high-power sputtering ,  super-hydrophobic surfaces

JST classification (2)： Transistors  (NC03070N) ,  Light emitting devices  (NC03082G)

Terms in the title (7)： 高出力 ,  スパッタリング ,  堆積 ,  自己制御 ,  超疎水性 ,  Cu ,  CuO