Art

J-GLOBAL ID：202002255359450333   Reference number：20A0780249

Thermocompression bonding of conductive polymers for electrical connections in organic electronics

有機エレクトロニクスにおける電気接続のための導電性高分子の熱圧縮接合

Author (3)： Maeda Kazuki (Osaka Research Institute of Industrial Science and Technology, Izumi, Osaka, Japan) ,  Nitani Masashi (Osaka Research Institute of Industrial Science and Technology, Izumi, Osaka, Japan) ,  Uno Mayumi (Osaka Research Institute of Industrial Science and Technology, Izumi, Osaka, Japan)
Material： Polymer Journal
Volume： 52  Issue： 4  Page： 405-412  Publication year： Apr. 2020 
JST Material Number： F0612A  ISSN： 0032-3896  CODEN： POLJB8  Document type： Article
Article type： 原著論文  Country of issue： Germany, Federal Republic of (DEU)  Language： ENGLISH (EN)

Thesaurus term： *Electronics ,  *bonding ,  *bonding and joining ,  heating ,  conducting polymer ,  hot pressing ,  compression molding ,  flexible circuit board ,  *electronic circuit ,  poly(ethylenedioxythiophene) ,  polystyrene sulfonic acid ,  polymer blend ,  contact resistance ,  polyethylene naphthalate ,  ATR spectroscopy ,  FTIR spectroscopy ,  intermolecular hydrogen bond ,  covalent bond ,  interface (surface) ,  solid phase ,  synthetic resin adhesive ,  electrical conductivity ,  thermo compression bonding ,  *organic electronics ,  poly(ethylene-dioxythiophene)/ poly(styrene sulphonic acid) ,  phase (thermodynamics)
Semi thesaurus term： ATR FTIR ,  PEDOT:PSS ,  flexible electronics ,  flexible printed circuit board ,  *electrical bonding ,  hot press ,  thermo compression bonding

JST classification (4)： Polymer carrier,catalytic reaction  (CG03030W) ,  Materials of solid-state devices  (NC03020K) ,  Printed circuits  (NA05040O) ,  Physical properties of polymer solids  (CG02024U)

Substance index (1)： 3,4-Ethylenedioxythiophene

Terms in the title (4)： 有機エレクトロニクス ,  電気接続 ,  導電性高分子 ,  熱圧縮