Art

J-GLOBAL ID：202002266522124132   Reference number：20A0565999

Influence of Seed Layer on LCP Substrate for High-speed Transmission Characteristics

高速伝送特性のためのLCP基板に及ぼすシード層の影響

Author (6)： ISHII Tomoyuki (Kanto Gakuin Univ., Kanagawa, JPN) ,  ISHII Tomoyuki (Toppan Printing CO., LTD., Tokyo, JPN) ,  NOH Joo-Hyong (Kanto Gakuin Univ., Kanagawa, JPN) ,  HONMA Hideo (Kanto Gakuin Univ., Kanagawa, JPN) ,  TAKAI Osamu (Kanto Gakuin Univ., Kanagawa, JPN) ,  WATANABE Mitsuhiro (Kanto Gakuin Univ., Kanagawa, JPN)
Material： 材料の科学と工学  (Materials Science and Technology of Japan)
Volume： 57  Issue： 1  Page： 28-36  Publication year： Feb. 20, 2020 
JST Material Number： G0788A  ISSN： 1347-4774  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *liquid crystal polymer ,  *substrate (plate) ,  lower layer ,  computer system (hardware) ,  signal transmission ,  *transmission speed ,  IC package ,  electroless plating ,  sputtering ,  Copper ,  interface (surface) ,  transmission line ,  transmission loss ,  transmission characteristic ,  skin effect ,  HF ,  arithmetic processor ,  S parameter ,  semiconductor package
Semi thesaurus term： *seed-layer ,  computing system

JST classification (2)： Materials of solid-state devices  (NC03020K) ,  Transmission circuit elements in general  (NC04010G)

Reference (31)：

• Japan Electronics Packaging and Circuit Association, Technology Roadmap for Printed Wiring Board 47 (2017) [in Japanese]
• Ministry of Internal Affairs and Communications Japan, WHITE PAPER 2018 Information and Communications in japan 72 (2018) [in Japanese]
• T. Nishio and Y. Yamaji, Journal of The Japan Institute of Electronics Packaging 4 [7], 546 (2001) [in Japanese]
• A. Tanaka, Journal of The Japan Institute of Electronics Packaging 8 [4], 271 (2005) [in Japanese]
• K. Takagi, Hyomen Gijutsu 59 [9], 570 (2008) [in Japanese]

Terms in the title (3)： 伝送特性 ,  LCP ,  シード層