Art
J-GLOBAL ID:202002280084538367   Reference number:20A0365719

Microscale Bonding Strength of Cu-Fe-Al Transferred Lamellar Microstructure Formed by Copper-Coated Seel Fine Particle Peening

銅めっきした鋼粒子を用いた微粒子ピーニングで創製されたCu-Fe-Al移着組織の微視的接合強度
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Volume: 84  Issue:Page: 28-35(J-STAGE)  Publication year: 2020 
JST Material Number: G0023A  ISSN: 0021-4876  CODEN: NIKGAV  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Hardening not due to thermal operation  ,  Mechanical properties 
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