Rchr
J-GLOBAL ID:202301013678853570   Update date: May. 23, 2024

Takakuwa Masahito

タカクワ マサヒト | Takakuwa Masahito
Affiliation and department:
Job title: Assistant Professor
Research field  (2): Electronic devices and equipment ,  Machine materials and mechanics
Research keywords  (4): Flexible bonding method ,  Plasma treatment ,  Surface activated bonding ,  Flexible electronics
Research theme for competitive and other funds  (5):
  • 2024 - 2027 伸縮性エレクトレットを用いた皮膚貼り付け型発電システムの開発
  • 2024 - 2026 無接着剤実装技術による粘弾性特性を回避した皮膚貼付け型データグローブの開発
  • 2023 - 2025 プラズマスチーム加熱によるポリマーと金属のハイブリット直接接合技術の開発
  • 2023 - 2025 次世代ウェアラブルデバイス構築に向けた脱着可能な超柔軟接合技術
  • 2021 - 2023 水蒸気プラズマを用いた超柔軟な導電接合技術の開発
Papers (12):
  • Lulu Sun, Jiachen Wang, Hiroyuki Matsui, Shinyoung Lee, Wenqing Wang, Shuyang Guo, Hongting Chen, Kun Fang, Yoshihiro Ito, Daishi Inoue, et al. All-solution-processed ultraflexible wearable sensor enabled with universal trilayer structure for organic optoelectronic devices. Science Advances. 2024. 10. 15
  • Sixing Xiong, Kenjiro Fukuda, Kyohei Nakano, Shinyoung Lee, Yutaro Sumi, Masahito Takakuwa, Daishi Inoue, Daisuke Hashizume, Baocai Du, Tomoyuki Yokota, et al. Waterproof and ultraflexible organic photovoltaics with improved interface adhesion. Nature Communications. 2024. 15. 1
  • Sungjun Park, Masahito Takakuwa, Kenjiro Fukuda, Sunghoon Lee, Tomoyuki Yokota, Takao Someya. Toward ultraflexible organic electronic devices. MRS Bulletin. 2023
  • Ruiqi Guo, Wenqing Wang, Masahito Takakuwa, Kenjiro Fukuda, Takao Someya. In Silico Design of Freeform Solar Cell Structures from High-Throughput Artificial Intelligence-Generated Configurations. Solar RRL. 2023
  • Baocai Du, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Sixing Xiong, Shinyoung Lee, Masahito Takakuwa, Lulu Sun, Jiachen Wang, et al. Surface-Energy-Mediated Interfacial Adhesion for Mechanically Robust Ultraflexible Organic Photovoltaics. ACS Applied Materials and Interfaces. 2023
more...
Patents (1):
Books (1):
  • The science of soft robots : design, materials and information processing
    Springer 2023 ISBN:9789811951732
Education (4):
  • 2021 - 2023 Waseda University Graduate School of Creative Science and Engineering Department of Modern Mechanical Engineering
  • 2019 - 2021 Waseda University Graduate School of Creative Science and Engineering Department of Modern Mechanical Engineering
  • 2015 - 2019 Waseda University School of Creative Science and Engineering Department of Modern Mechanical Engineering
  • 2012 - 2015 Tokyo Tech High School of Science and Technology
Work history (5):
  • 2023/06 - 現在 RIKEN Visiting Researcher
  • 2023/04 - 現在 The University of Tokyo The Graduate School of Engineering Institute of Engineering Innovation, Yokota lab. Assistant Professor
  • 2023/09 - 2024/03 Waseda University Faculty of Science and Engineering Part-time lecturer
  • 2021/04 - 2023/03 Japan Society for the Promotion of Science
  • 2018/04 - 2023/03 RIKEN
Awards (9):
  • 2023/01 - 日本学術振興会 育志賞
  • 2023/01 - Certificate of Merit for Best Presentation Low-temperature direct bonding of thin parylene film for the integrated ultrathin electronics
  • 2022/03 - 早稲田大学理工学術院総合研究所 WASEDA Early Bird PRESENTATION CONTEST 最優秀賞
  • 2022/03 - 早稲田大学理工学術院総合研究所 若手研究者奨励賞
  • 2021/03 - 早稲田大学 小野梓記念学術 Nanograting Structured Ultrathin Substrate for Ultraflexible Organic Photovoltaics
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Association Membership(s) (3):
The Japan Society of Mechanical Engineers. ,  Japan Society of Applied Physics ,  The Society of Materials Science, Japan
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