Matsushima Michiya

マツシマミチヤ | Matsushima Michiya

Affiliation and department：

Research field (3)： Electronic devices and equipment , Mechanics and mechatronics , Robotics and intelligent systems

Research keywords (8)：視覚検査 , 機能デバイス信頼性評価 , 微細システム , 電子システムインテグレーション , Visual inspection , Packaging reliability , Micro system , Electronics system integration

Research theme for competitive and other funds (14)：

2021 - 2024 ポーラスインサート材を用いた自発的液相浸透接合法の開発
2021 - 2024 セルロースナノファイバーを用いたイオン化金属析出による高伝導導電性樹脂接合法
2018 - 2021 Development of conductive paste for 3D printed wiring corresponding to ampere-class current and the mechanism of conductivity expression
2015 - 2017 High electric and thermal conductivity resin bonding with ionized metal
2014 - 2016 Development of novel electronic device packaging using hybrid resin sheet containing solder particles

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Papers (85)：

Ryo Miyajima, Ryota Yagane, Michiya Matsushima, Shinji Fukumoto. Transient liquid-phase infiltration bonding of copper using porous copper interlayer. Journal of Materials Science: Materials in Electronics. 2024. 35. 5
Yuto TANAKA, Ryosuke TSUTSUI, Michiya MATSUSHIMA, Shinji FUKUMOTO. Electrodeposition Bonding of Copper to Aluminum via Anodic Oxide Film. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 2023. 41. 4. 356-363
Shinji Fukumoto, Kazuhiro Makimoto, Kengo Ohta, Tomohiro Nakamura, Michiya Matsushima, Kozo Fujimoto. Change in electrical conductivity of electrically conductive adhesives during curing process. Journal of Materials Science. 2022. 57. 24. 11189-11201
屋金崚太, 松嶋道也, 福本信次. Liquid Phase Infiltration Bonding of Copper Using Low Melting Point Metal and Porous Sheet. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th
多田剛志, 石原佑真, 松嶋道也, 寺岡巧智, 中村健太, 萬田哲史, 見島雄太, 杉田卓也, 藤本公三, 福本信次. Robot Soldering with Control of Bonding Temperature by Operating Parameters. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th

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MISC (160)：

福本信次, 牧本和大, 多谷本真聡, 深田健太郎, 松嶋道也, 藤本公三. Change in Contact Resistance and Interfacial Microstructure at Press-Fit Connection Under Large Current Loading. 銅と銅合金. 2021. 60. 1. 207-212
福本信次, 牧本和大, 多谷本真聡, 松嶋道也, 藤本公三. 大電流負荷に対するプレスフィット端子の接触抵抗および界面組織変化. 日本銅学会講演大会講演概要集. 2020. 60th
Effective Factors on the Reliability Evaluation of Electronics Joint with Repetitive Bending Test. Proceedings of JIEP Annual Meeting. 2018. 32. 372-375
FUKUMOTO Shinji, KIZAWA Toshinari, MATSUSHIMA Michiya, HOKAZONO Hiroaki, FUJIMOTO Kozo. Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer (エレクトロニクス産業のもの創りにおける材料、プロセス、システム設計). スマートプロセス学会誌 = Journal of smart processing. 2017. 6. 5. 188-194
Adhesive Strength and Stress Components on Interface between Metal and Epoxy Resin. MES. 2017. 27. 65-68

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Patents (3)：

Books (2)：

マイクロ接合・実装技術
産業技術サービスセンター 2012 ISBN:9784915957888
標準マイクロソルダリング技術
日刊工業新聞社 2011 ISBN:9784526066535

Works (2)：

電子デバイスの自己組織化実装における金属フィラー溶融凝集機構の解明
2008 -
高信頼性電子デバイス生産システムの研究開発
2006 -

Education (5)：

- 2005 Osaka University
- 2005 Osaka University
- 2002 Osaka University
- 2002 Osaka University
- 2000 Osaka University School of Engineering Science Direct Affiliates

Professional career (3)：

Ph.D(Engineering) (Osaka University)
Master's Degree of Engineering (Osaka University)
Bachelor's Degree(Engineering) (Asahikawa University)

Work history (2)：

2005 - - 大阪大学大学院・助教
2005 - - Osaka University, Assistant Professor

Awards (3)：

2018/09 - エレクトロニクス実装学会 MES2017 ベストペーパー賞
2010 - マイクロ接合優秀研究賞
2001 - 第52回塑性加工連合講演会ポスターセッション優秀賞

Association Membership(s) (3)：

The Japan Institute of Electronics Packaging , 日本溶接学会 , Smart Processing Society for Materials, Environment & Energy

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