Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka. Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics. Journal of Vacuum Science & Technology B. 2022. 40. 5. 052202-052202
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka. Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices. 2022 IEEE International Interconnect Technology Conference (IITC). 2022
Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka. Direct fabrication of SU-8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor. Electronics and Communications in Japan. 2022. 105. 2
Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka. Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes. Applied Physics Express. 2022. 15. 11. 111004-1-111004-5
3D-IC Technology and Reliability Challenges
(17th International Workshop on Junction Technology(IWJT2017) 2017)
Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE
(2017 IEEE 67th Electronic Components and Technology Conference (ECTC2017) 2017)
Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission
(IEEE International Interconnect Technology Conference (IITC 2017) 2017)
The Association for Research in Vision and Ophthalmology
, エレクトロニクス実装学会
, 電気学会
, 日本機械学会
, 応用物理学会
, 電子情報通信学会
, 日本生体医工学会
, The Institute of Electrical and Electronics Engineers