Kino Hisashi

キノヒサシ | Kino Hisashi

Affiliation and department：
Other affiliations (1)：

Tohoku University Graduate School of Biomedical Engineering Visiting Associate Professor

Research field (1)： Electronic devices and equipment

Research theme for competitive and other funds (15)：

2021 - 2025 Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin Display
2021 - 2024 人と同じ視野角と情報処理機能を有する極低侵襲ピクセル分散型完全埋植人工網膜の開発
2021 - 2024 メカニカルストレスが身体不活動で生じる脳・骨格筋の慢性炎症を抑制する分子機構
2020 - 2023 不揮発性トンネルFETメモリによる超低消費電力ニューラルネットワークチップの開発
2019 - 2023 Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress Engineering

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Papers (154)：

Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada, Mariappan Murugesan, Hiryuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, et al. D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations. 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). 2024. 60. 420-426
Atsushi Shinoda, Chang Liu, Akihiro Tominaga, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly. 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). 2024. 849-854
Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics. Japanese Journal of Applied Physics. 2024. 63. 4. 04SP74-04SP74
Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach. 2023 IEEE CPMT Symposium Japan (ICSJ). 2023. 45-48
Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima. FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display. 2023 IEEE CPMT Symposium Japan (ICSJ). 2023. 49-52

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MISC (56)：

高橋則之, 煤孫祐樹, WANG Z., 小田島輩, 木野久志, 田中徹, 田中徹, 福島誉史, 福島誉史. Fabrication and Characterization of Sterilization Hydrogel Patch with Embedded UV-LED. 応用物理学会春季学術講演会講演予稿集(CD-ROM). 2021. 68th
高橋則之, 煤孫祐樹, 木野久志, 田中徹, 田中徹, 福島誉史, 福島誉史. Interconnect Formation on Hydrogel Flexible Substrates Using RDL-First FOWLP Technologies. 電子情報通信学会論文誌 C(Web). 2020. J103-C. 3
小田島輩, 煤孫祐樹, QIAN Zhengyang, 高橋則之, 永田柊太, 木野久志, 田中徹, 田中徹, 福島誉史, 福島誉史. PPG Sensor Integration Using Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave Monitoring. 応用物理学会秋季学術講演会講演予稿集(CD-ROM). 2020. 81st
永田柊太, 木野久志, 田中徹, 田中徹, 福島誉史, 福島誉史. Flexible 3D-Wrinkled Wire Formation for In-Mold Electronics. 応用物理学会秋季学術講演会講演予稿集(CD-ROM). 2020. 81st
三輪侑紀, LEE Sungho, LIANG Rui, 木野久志, 福島誉史, 田中徹, 田中徹. Multichip-to-Wafer三次元集積化基盤技術の開発(3)-異種機能集積化に向けたマイクロバンプ接合技術-. 応用物理学会春季学術講演会講演予稿集(CD-ROM). 2019. 66th

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Books (1)：

Lectures and oral presentations (68)：

Development of Ultrathin-Metal-Capped Transparent Conductive Film Electrode for Optical Biomedical Devices
(2021 International Conference on Solid State Devices and Materials 2021)
Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs
(2021 IEEE International Interconnect Technology Conference 2021)
Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD
(Solid State Devices and Materials 2020)
Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices
(Solid State Devices and Materials 2020)
Development of Optical Waveguiding Neural Probe with Upconversion-Nanoparticle Light Emitter for Optogenetics
(Solid State Devices and Materials 2020)

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Professional career (1)：

Awards (1)：

2018/03 - 一般財団法人田中貴金属記念財団 2017年度「貴金属に関わる研究助成金」シルバー賞 3D-NANDフラッシュメモリの大容量・低コスト・高信頼化に向けた超高密度Ptナノ粒子を有する電荷保持層の開発

Association Membership(s) (2)：

IEEE , 応用物理学会

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