Rchr
J-GLOBAL ID：200901021926100314
Update date: Feb. 01, 2024
Ikeda Akihiro
イケダ アキヒロ | Ikeda Akihiro
Contact this researcher
You can send email directly to the researcher.
Affiliation and department：
Kyushu University Faculty of Information Science and Electrical Engineering
About Kyushu University Faculty of Information Science and Electrical Engineering
Search "Kyushu University Faculty of Information Science and Electrical Engineering"
Job title：
Assistant Professor
Homepage URL (1)：
http://hyoka.ofc.kyushu-u.ac.jp/search/details/K000268/research.html
Research field (1)：
Electronic devices and equipment
Research keywords (2)：
SiCへのレーザードーピング,3次元実装
, 3D-SiP
Research theme for competitive and other funds (5)：
2014 - 2016 Investigation on mechanism of wet chemical laser doping of 4H-SiC by optical emission spectroscopy
2009 - 2011 Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.
2005 - 2007 バンプレス接続によるチップオンフイルムとフイルム折曲げによる3D-SiPの作製
2002 - 2004 異方性ウエットエッチングを用いた溝型ゲートMOSトランジスタの作製
2003 - 3D stacked system in a package for IC assembly
MISC (48)：
Akihiro Ikeda, Atsushi Sakamoto, Reiji Hattori, Yukinori Kuroki. Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package. THIN SOLID FILMS. 2009. 517. 5. 1740-1745
Akihiro Ikeda, Tsubasa Saeki, Atsushi Sakamoto, Yosuke Sugimoto, Yasuhiro Kimiya, Yoshiaki Fukunaga, Reiji Hattori, Hisao Kuriyaki, Yukinori Kuroki. Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2007. 30. 3. 494-499
Akihiro Ikeda, Tsubasa Saeki, Atsushi Sakamoto, Yosuke Sugimoto, Yasuhiro Kimiya, Yoshiaki Fukunaga, Reiji Hattori, Hisao Kuriyaki, Yukinori Kuroki. Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2007. 30. 3. 494-499
Akihiro Ikeda, Kiyoshi Hamaguchi, Hiroshi Ogi, Kazuya Iwasaki, Reiji Hattori, Yukinori Kuroki. Mobility change of MOSFETs in a chip-stacked multichip package. ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS. 2006. 89. 7. 1-8
Akihiro Ikeda, Kiyoshi Hamaguchi, Hiroshi Ogi, Kazuya Iwasaki, Reiji Hattori, Yukinori Kuroki. Mobility change of MOSFETs in a chip-stacked multichip package. ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS. 2006. 89. 7. 1-8
ｍore...
Education (4)：
- 1999 Kyushu University
- 1999 Kyushu University
- 1994 Kyushu University School of Engineering
- 1994 Kyushu University Faculty of Engineering
Professional career (2)：
Master of engineering (Kyushu University)
Doctor of Engineering (Kyushu University)
Work history (2)：
2007 - 現在 九州大学システム情報科学研究院 助教
1999 - 2006 九州大学システム情報科学研究院 助手
Association Membership(s) (2)：
電子情報通信学会
, 日本応用物理学会
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in
researchmap
.
For details, see here
.
Return to Previous Page
TOP
BOTTOM
