Rchr
J-GLOBAL ID:200901052684370055
Update date: Aug. 28, 2020
Tsunetsugu Hideki
ツネツグ ヒデキ | Tsunetsugu Hideki
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Research field (2):
Communication and network engineering
, Electronic devices and equipment
Research keywords (4):
光通信
, マイクロエレクトロニクス
, optical communication
, microelectronics
Research theme for competitive and other funds (4):
2001 - ヒューマンコミュニケーションに関する研究
2001 - 光通信用電気・光部品に関する研究
2001 - Study on human Communication
2001 - Study on optoelectrical component for optical communication
MISC (18):
N Iwasaki, M Yanagibashi, H Tsunetsugu, K Kato, F Ishitsuka, M Hosoya, H Kikuchi. Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2001. 24. 4. 429-433
N Iwasaki, M Yanagibashi, H Tsunetsugu, K Kato, F Ishitsuka, M Hosoya, H Kikuchi. Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface. IEEE TRANSACTIONS ON ADVANCED PACKAGING. 2001. 24. 4. 429-433
OE-COF(Optoelectronic Chip on Film)実装技術の検討. 電子情報通信学会論文誌. 2001. J84-C. 9. 800-806
Noboru Iwasaki, Fuminori Ishitsuka, Hideki Tsunetsugu, Kazutoshi Kato. High-performance flip-chip technique with an optimized coplanar waveguide. International Journal of RF and Microwave Computer-Aided Engineering. 2000. 10. 5. 289-295
KOSHOUBU N, ISHIZAWA S, TSUNETSUGU H, TAKAHARA H. Advanced flip bonding technigue using transferred microsolder Bumps. IEEE Trans. CPMT. 2000. 23. 2. 399-404
more...
Patents (4):
はんだバンプの形成方法およびそれを用いた接続方法
電気・光配線基板,電気・光機能デバイスおよびそれらの製造方法,並びにそれらから成る電気・光機能モジュール
はんだバンプの接続方法
はんだバンプの形成方法,はんだバンプの接続方法および加圧治具
Education (2):
- 1975 Shinshu University
- 1975 Shinshu University Graduate School, Division of Engineering
Professional career (1):
(BLANK) (Shinshu University)
Work history (2):
1975 - 2001 日本電信電話株式会社 主幹研究員2001- 松江工業高等専門学校
1975 - 2001 NTT Senior Research Engineer2001- Matsue National College of Technology Professor
Association Membership(s) (3):
日本感性工学会
, エレクトロニクス実装学会
, 電子情報通信学会
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