Rchr
J-GLOBAL ID：200901083372517671   Update date: Sep. 18, 2022

Zhang ShengDe

チョウ セイトク | Zhang ShengDe
Affiliation and department：
Ritsumeikan University Research Organization of Science and Engineering, Advanced Micro/Nano System Technology Research Center, Research Organization of Science and Engineering Advanced Micro/Nano System Technology Research Center

About Ritsumeikan University Research Organization of Science and Engineering, Advanced Micro/Nano System Technology Research Center, Research Organization of Science and Engineering Advanced Micro/Nano System Technology Research Center


Job title： Research Assistant
Homepage URL  (1)： http://www.ritsumei.ac.jp/se/~sakanem/sakanelabo/index.htm
Research field  (2)： Metallic materials ,  Machine materials and mechanics
Research keywords  (15)： 電子デバイス用薄膜の材料特性評価 ,  電子デバイス用鉛フリーはんだの強度 ,  先進耐熱材料の高温強度評価 ,  多軸クリープ変形および破断特性 ,  多軸応力下での低サイクル疲労寿命評価 ,  Cruciform specimen ,  Creep-fatigue ,  Multiaxial ,  Lead Free ,  Interface ,  Crack ,  Low Cycle Fatigue ,  Solder ,  Materials and Mechanics ,  Materials strength at high temperature
Research theme for competitive and other funds  (6)：
  • (3)SUS304ステンレス鋼の十字型試験片を用いた高温多軸クリープ疲労寿命評価法の研究
  • (2)SUS304鋼十字型試験片を用いた高温多軸クリープ破断に関する研究
  • (1)はんだ接合材の低サイクル疲労き裂進展挙動に関する研究
  • (3)Multiaxial Creep-fatigue Life Assessment Using Cruciform Specimen for Type304 Stainless Steel at High Temperatures
  • (2)Creep Rupture Life and Damage Evaluation Under Multiaxial Stress State for Type 304 Stainless Steel
Show all
MISC (27)：
ｍore...
Books (1)：
  • 例題で学ぶMarc有限要素法解析入門
    丸善出版 2011 ISBN:9784621083628
Lectures and oral presentations  (60)：
  • 2種類のアンダーフィル樹脂薄膜の低サイクル疲労き裂発生および進展特性
    (日本材料学会第60期学術講演会 2011)
  • ポリアミド樹脂薄膜の引張特性およびフィラー含有量の影響
    (日本材料学会第60期学術講演会 2011)
  • 非比例多軸負荷におけるマルエージング鋼の疲労き裂進展挙動
    (日本材料学会第60期学術講演会 2011)
  • Mechanical Properties of Copper Thin Films Used in Electronic Devices
    (11th International Conference on the Mechanical Behavior of Materials 2011)
  • Mechanical Properties of Copper Thin Films Used in Electronic Devices
    (11th International Conference on the Mechanical Behavior of Materials 2011)
ｍore...
Education (6)：
  • - 2007 Ritsumeikan University Graduate School of Science and Engineering
  • - 2007 Ritsumeikan University "Graduate School, Science and Engineering" Integrated Science and Engineering
  • - 2003 北京科学技術大学 材料科学研究科 金属材料
  • - 2003 University of Science and Technology Beijing "Graduate School, Division of Materials Science" Metal Materials
  • - 2000 北京科学技術大学(China) 工学部 材料工学
Show all
Professional career (1)：
  • Doctor of Engineering (Ritsumeikan University)
Work history (5)：
  • 2010 - 2011 :米国イリノイ大学シャンペーン分校 機械工学科・客員研究員
  • 2010 - 2011 :Illinois University Urbana-Champaign, Visiting scholor
  • 2007 - -:立命館大学理工学部・助教
  • 2007 - -:Ritsumeikan University・Assistant Professor
  • Ritsumeikan University Institute of Science and Engineering College of Science and Engineering, Department of Mechanical Engineering, Institute of Science and Engineering College of Science and Engineering Department of Mechanical Engineering Assistant Professor
Awards (1)：
  • 2009 - 第19回マイクロエレクトロニクスシンポジウム(MES2009)研究奨励賞
Association Membership(s) (6)：
日本材料学会 ,  日本機械学会 ,  エレクトロニクス実装学会 ,  The Society of Materials Science, Japan ,  The Japan Society of Mechanical Engineering ,  Japan Institute of Electronics Packaging
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in researchmap. For details, see here.

Return to Previous Page

TOP

BOTTOM