Rchr
J-GLOBAL ID:200901084395276198   Update date: Jan. 17, 2024

Sugiyama Susumu

スギヤマ ススム | Sugiyama Susumu
Affiliation and department:
Job title: Visiting Senior Researcher
Other affiliations (3):
Research field  (4): Control and systems engineering ,  Electronic devices and equipment ,  Mechanics and mechatronics ,  Robotics and intelligent systems
Research keywords  (1): Electronic Measurements and Control Engineering, Intelligent Mechanics, Electron Devices and Apparatus Engineering
Research theme for competitive and other funds  (2):
  • 2010 - 2010 ポリマーMEMSデバイスの製作技術開発
  • 2010 - 2010 京都環境ナノクラスター
Papers (241):
Patents (23):
  • レジスト膜の形成方法及び超小型構造体の作製方法
  • 半導体圧力センサ
  • 磁気センサ
  • 半導体ひずみゲージ及びそれを用いたひずみ測定方法
  • X線露光用レジスト基板及びその製造方法、該レジスト基板を用いた金型の製造方法並びに該金型を用いたマイクロ部品の製造方法
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Books (28):
  • Recent Advances in Nanofabrication Techniques and Applications, Ed. by Bo Cui, Chapter 16: Fabrication of 3-D Structures Utilizing Synchrotron Radiation Lithography
    In-Tech, Vienna, Austria 2011 ISBN:9789533076027
  • Nanowires, Chapter15: Electronic States and Piezoresistivity in Silicon Nanowires
    In-Tech, Vienna, Austria 2010 ISBN:9789537619794
  • MEMS/NEMS工学全集、桑野博喜 監修、第3章 MEMS/NEMSプロセス基盤技術、第10節 厚膜プロセス、1.LIGA
    テクノシステム 2009
  • Springer Proceedings in Physics, Vol.127: Physics and Engineering of New Materials, "Design and Fabrication of a Miniaturized Three-Degree-of-Freedom Piezoresistive Acceleration Sensor Based on MEMS T echnology Using Deep Reactive Ion Etching"
    Springer Berlin Heidelberg 2009 ISBN:9783540882008
  • ナノテクノロジーハンドブックI編 創る(第1分冊)、ナノテクノロジーハンドブック編集委員会編、5章ナノ構造の製作技術、5・3 LIGAプロセス
    オーム社 2003
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Lectures and oral presentations  (638):
  • Application of Polymer MEMS to Material Fatigue Testing
    ((ICAMN 2014) The 2nd Int'l Conf. on Advanced Materials and Nanotechnology, Hanoi, Vietnam, Oct.29-Nov.1, 2014 2014)
  • Road to Development of Piezoresistive Semiconductor Pressure Sensor
    (The 31th Sensor Symposium on Sensors, Micromachines, and Applied Systems, Oct.20-22, 2014, Matsue City, Shimane, Japan, The Inst. of Electrical Engineers of Japan, 22am2-B1(6p) 2014)
  • Electrostatic Resonator for Fatigue Test of Polymer Material
    (The 31th Sensor Symposium on Sensors, Micromachines, and Applied Systems, Oct.20-22, 2014, Matsue City, Shimane, Japan, The Inst. of Electrical Engineers of Japan, 21pm3-PS6(6p) 2014)
  • Fatigue Testing of PMMA Using Polymer MEMS Actuator Fabricated by Hot Embossing
    ((APCOT 2014) The 7th Asia-Pacific Conf. on Transducers and Micro/Nano Technologies, Jun.29-July 2, 2014, Daegu, Korea, Proc. 14-1(2p) 2014)
  • Development of Environmental Friendly Polymer MEMS Process Technology and Its Application
    ((IWNA 2013) The 4th Int'l Workshop on Nanotechnology and Application, Nov.14-16,2013, Vung Tau, Vietnam 2013)
more...
Education (2):
  • - 1970 Meijo University Faculty of Science and Engineering Department of Electric Engineering
  • Tokyo Institute of Technology
Professional career (1):
  • Doctor of Engineering (Tokyo Institute of Technology)
Work history (8):
  • 2000/12/01 - 2010/12/31 Director of Research Inst. for Nanomachine System Technology
  • 2008/04/01 - Ritsumeikan-Global Innobvation Research Organization, Ritsumeikan Univ.: Professor
  • 2007/04/01 - 2008/03/31 The Organization for the Promotion of the COE Program, Ritsumeikan Univ.: Professor
  • 1995/04/01 - 2007/03/31 Dept. of Science and Engineering, Ritsumeikan Univ.: Professor
  • 1998/04/01 - 2002/03/31 Vice Derector of SR(Synchrotron Radiation) Center, Ritsumeikan Univ.
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Committee career (18):
  • 1995/05 - 2012 MYU K.K., Tokyo Editor-in-Chief of the Journal, "Sensors and Materials"
  • 1995/05 - 2012 MYU K.K., Tokyo Editor-in-Chief of the Journal, "Sensors and Materials"
  • 1995/05 - 2012 MYU K.K., Tokyo Sensors and Materials(MYU K.K., Tokyo) 編修委員長
  • 2007/05 - 2011 The Japan Institute of Electronics Packaging (JIEP) Executive of the Japan Institute of Electronics Packaging (JIEP)
  • 2007/05 - 2011 The Japan Institute of Electronics Packaging (JIEP) Executive of the Japan Institute of Electronics Packaging (JIEP)
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Awards (12):
  • 2012/08 - Governor of Kyoto Prefecture Appreciation Award, from Mr. Keiji Yamada, Governor of Kyoto Prefecture, for contribution to the technical solution of the small and medium enterprises
  • 2012/05 - The Institute of Electrical Engineers of Japan The Honorable Achievement Award, from The Inst. of Electrical Engineers of Japan
  • 2011/05 - The Institute of Electrical Engineers of Japan Awarded the Title of Fellow from The Inst. of Electrical Engineers of Japan
  • 2009/11 - The Japan Society for Analytical Chenmistry The Excellent Poster Award in "Tokyo Conference 2009", from The Japan Society for Analytical Chenmistry
  • 2008/11 - IEEE MHS MHS2008(IEEE) Best Paper Award
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Association Membership(s) (6):
"The Institute of Electrical Electronics Engineers, Inc." ,  The Robotics Society of Japan ,  The Japan Society of Mechanical Engineers ,  The Japan Society of Applied Physics ,  The Japan Institute of Electronics Packaging (JIEP) ,  The Institute of Electrical Engineers of Japan
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