Art
J-GLOBAL ID：200902020733377618   Reference number：87A0479491

Investigations of large PLCC package cracking during surface mount exposure.

面実装工程中に生じるPLCCパッケージのクラックの研究
Author (2)：
STEINER T O

About STEINER T O

(Digital Equipment Corp., MA, USA)

About Digital Equipment Corp., MA, USA

, 
SUHL D

About SUHL D

(Digital Equipment Corp., MA, USA)

About Digital Equipment Corp., MA, USA


Material：
IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (IEEE Trans Components Hybrids Manuf Technol)

About IEEE Transactions on Components, Hybrids, and Manufacturing Technology


Volume： 10  Issue： 2  Page： 209-216  Publication year： Jun. 1987 
JST Material Number： H0255B  ISSN： 0148-6411  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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high density packaging

About high density packaging

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
PLCC

About PLCC

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
面実装

About 面実装

, 
PLCCパッケージ

About PLCCパッケージ

, 
クラック

About クラック

, 
研究

About 研究


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