Art
J-GLOBAL ID:200902041452051281   Reference number:91A0656858

Surface Treatment of Copper Inner-layer with Electroless Copper Using Hypophosphite as a Reducing Agent.

次亜リン酸塩を還元剤とする無電解銅めっきによる内層銅箔処理
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Volume:Issue:Page: 209-214  Publication year: Jul. 1991 
JST Material Number: X0497A  ISSN: 0914-8299  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Printed circuits  ,  Electroless plating 
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