Art
J-GLOBAL ID:200902125713751374   Reference number:96A1020970

Trends of Technologies in Build-Up Type Multilayer Boards-Key Technology for High Density Packaging. Present and Future of Technologies for Build-Up Type Multilayer Boards.

高密度化の鍵!! ビルドアップ配線板技術の動向を探る ビルドアップ多層配線板技術の現状と課題
Author (1):
Material:
Volume: 11  Issue:Page: 462-468  Publication year: Nov. 1996 
JST Material Number: X0497A  ISSN: 1341-0571  Document type: Article
Article type: 解説  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
Thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
,...
Semi thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=96A1020970&from=J-GLOBAL&jstjournalNo=X0497A") }}
JST classification (1):
JST classification
Category name(code) classified by JST.
Printed circuits 
Reference (12):
more...
Terms in the title (6):
Terms in the title
Keywords automatically extracted from the title.

Return to Previous Page