Art
J-GLOBAL ID：200902126869760779   Reference number：97A0914792

Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading.

熱サイクル負荷のもとでのマイクロエレクトロニクス半田接続の疲労-強度予測
Author (2)：
YU Q

About YU Q

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN

, 
SHIRATORI M

About SHIRATORI M

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN


Material：
IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A  (IEEE Trans Compon Packag Manuf Technol Part A)

About IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A


Volume： 20  Issue： 3  Page： 266-273  Publication year： Sep. 1997 
JST Material Number： H0255C  ISSN： 1070-9886  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
BGA【ICパッケージ】

About BGA【ICパッケージ】

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement,testing and reliability of solid-state devices 
(NC03040G)

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Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
熱サイクル

About 熱サイクル

, 
マイクロエレクトロニクス

About マイクロエレクトロニクス

, 
半田

About 半田

, 
疲労

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, 
予測

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