Art
J-GLOBAL ID：200902134674741888   Reference number：99A0698980

Thermal fatigue reliability assessment for solder joints of BGA assembly.

BGA組立のはんだ接合部に対する熱疲れ信頼性評価
Author (2)：
YU Q

About YU Q

(Yokohama National Univ., Hodogaya-ku, JPN)

About Yokohama National Univ., Hodogaya-ku, JPN

, 
SHIRATORI M

About SHIRATORI M

(Yokohama National Univ., Hodogaya-ku, JPN)

About Yokohama National Univ., Hodogaya-ku, JPN


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 26  Issue： Vol.1  Page： 239-246  Publication year： 1999 
JST Material Number： W0624A  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*thermal fatigue

About thermal fatigue

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Electric and electronic parts in general 
(NA05010H)

About Electric and electronic parts in general

,  Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
BGA

About BGA

, 
組立

About 組立

, 
はんだ接合部

About はんだ接合部

, 
熱疲れ

About 熱疲れ

, 
信頼性評価

About 信頼性評価


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