Art
J-GLOBAL ID：200902194142432650   Reference number：97A0830010

Reliability and structure optimization of BGA packages.

BGAパッケージの信頼性と構造最適化
Author (4)：
YU Q

About YU Q

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN

, 
KASHIWAMURA T

About KASHIWAMURA T

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN

, 
SHIRATORI M

About SHIRATORI M

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN

, 
SATOH K

About SATOH K

(Yokohama National Univ., Yokohama, JPN)

About Yokohama National Univ., Yokohama, JPN


Material：
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)  (ASME EEP (Am Soc Mech Eng Electr Electron Packag Div.))

About ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)


Volume： 19  Issue： Volume 2  Page： 1761-1765  Publication year： 1997 
JST Material Number： W0624A  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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reliability (property)

About reliability (property)

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
BGA【パッケージ】

About BGA【パッケージ】

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (2)：
Terms in the title
Keywords automatically extracted from the title.
BGAパッケージ

About BGAパッケージ

, 
構造最適化

About 構造最適化


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