Art
J-GLOBAL ID：200902194494611300   Reference number：94A0068185

Application of Epoxy Resins to Semiconductor Devices.

エポキシ樹脂の半導体デバイスへの応用
Author (1)：
KANEGAE HIROZO

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(三菱電機 中研)

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Material：
日本接着学会誌  (Journal of the Adhesion Society of Japan)

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Volume： 29  Issue： 12  Page： 580-587  Publication year： Dec. 1993 
JST Material Number： G0749A  ISSN： 0916-4812  CODEN： NSEGE7  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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epoxy resin

About epoxy resin

,...
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Electric insulating materials 
(YH06020F)

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エポキシ樹脂

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, 
半導体デバイス

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, 
応用

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