Art
J-GLOBAL ID:200902194853260275   Reference number:97A0829968

Fatigue crack propagating evaluation of microelectronics solder joints.

マイクロエレクトロニクスのはんだ継手の疲労割れの伝播の評価
Author (3):
Material:
Volume: 19  Issue: Volume 2  Page: 1445-1450  Publication year: 1997 
JST Material Number: W0624A  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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JST classification (3):
JST classification
Category name(code) classified by JST.
Metallic materials  ,  Brazing  ,  Connecting parts 
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