Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers.

ROSSNAGEL S M; SHERMAN A; TURNER F

Art

J-GLOBAL ID：200902196197013137 Reference number：00A0812363

Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers.

相互接続の拡散障壁用のTa及びTi膜のプラズマ増強原子層蒸着

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=00A0812363&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=00A0812363&from=J-GLOBAL&jstjournalNo=E0974A") }}

Author (3)： , ,
Material：
Volume： 18 Issue： 4 Page： 2016-2020 Publication year： Jul. 2000
JST Material Number： E0974A ISSN： 1071-1023 CODEN： JVTBD9 Document type： Article
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=00A0812363&from=J-GLOBAL&jstjournalNo=E0974A") }}

Metallic thin films , Manufacturing technology of solid-state devices

, , , , , ,

Return to Previous Page