Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet

HAZAMA H; MATSUDA T; MIZUTANI U; IKUTA H; YANAGI Y; ITOH Y; SAKURAI K; SEKIGUCHI A; IMAI A

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J-GLOBAL ID：200902204108080260 Reference number：04A0785945

Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet

超伝導バルク磁石を用いて活性化されたマグネトロンスパッタリングにより調べた高いアスペクト比を持つ200nmクラスの円形通路に対するCu蒸着による底面被覆

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Material：
Volume： 43 Issue： 9A Page： 6026-6031 Publication year： Sep. 15, 2004
JST Material Number： G0520B ISSN： 0021-4922 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Metallic thin films

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