Art

J-GLOBAL ID：200902204940632214   Reference number：07A0159259

Assembly Technology Using Lead-free Solder

鉛フリーはんだを使うアセンブリ技術

Author (2)： YAMAMOTO Tsuyoshi (Fujitsu Ltd.) ,  TSUBONE Ken-ichiro (Fujitsu Ltd.)
Material： Fujitsu Scientific & Technical Journal  (FSTJ)
Volume： 43  Issue： 1  Page： 50-58  Publication year： Jan. 2007 
JST Material Number： S0076A  ISSN： 0016-2523  CODEN： FUSTA  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： solder ,...
Semi thesaurus term： RoHS ,...

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JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Reference (9)：

• IPC/JEDEC J-STD-020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.2004. JEDEC|REE Download Area|J-STD-020C. http://www.jedec.org/download/search/jstd020c.pdf
• H. Uchida et al.: Thermal Analysis of Printed Circuit Boards for Infrared Reflow Soldering.1998 International Symposium on Microelectronics (IMAPS1998), San Diego, 1998, p. 63-68.
• M. Ochiai et al.: Reliability of Solder Joints Assembled with Lead-Free Solder. FUJITSU Sci. Tech. J., 38, 1, p. 96-101(2002).
• H. Yagi et al.: Lead-Free Solders Property and Reliability of Electronics Packaging.(in Japanese), M & M2002, JSME, Yamaguchi, 2002, p. 225-226.
• M. Kitajima et al.: Development of Sn-Zn-Al Lead-Free Solder Alloys. FUJITSU Sci. Tech. J., 41, 2, p. 225-235(2005).

Terms in the title (2)： 鉛フリーはんだ ,  アセンブリ