Art
J-GLOBAL ID:200902210462497128   Reference number:08A0094979

Argon-hydrogen plasma cleaning effect on electroless Ni plating for under bump metallurgy of solder bump

はんだバンプのバンプ下地金属のためのアルゴン-水素プラズマ清浄効果の無電解ニッケルめっきに対する影響
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Material:
Volume: 2007  Page: 65-66  Publication year: 2007 
JST Material Number: Y0378B  Document type: Proceedings
Article type: 短報  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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Category name(code) classified by JST.
Applications of plasma  ,  Electroless plating 

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