Art

J-GLOBAL ID：200902214274629578   Reference number：05A0436662

Analysis of Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Film during Moisture/Reflow Sensitivity Test

異方性導電樹脂接合型フリップチップの吸湿リフロー試験時のはく離予測解析

Author (3)： KIM Won-Keun (九大 大学院工学研究府) ,  IKEDA TOORU (京大 大学院工学研究科) ,  MIYAZAKI NORIYUKI (京大 大学院工学研究科)
Material： エレクトロニクス実装学会誌  (Journal of Japan Institute of Electronics Packaging)
Volume： 8  Issue： 3  Page： 215-224  Publication year： May. 01, 2005 
JST Material Number： S0579C  ISSN： 1343-9677  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *flip chip method ,...
Semi thesaurus term： 異方性導電樹脂フィルム ,...

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JST classification (2)： Electric contacts  (NA05070V) ,  Measurement,testing and reliability of solid-state devices  (NC03040G)

Reference (18)：

• HELGE, K. Overview of conductive adhesive interconnection technologies for LCD's. IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part A. 1998, 21-2, 208-214
• CHIU, Y. W. Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectronics Reliability. 2002, 42-12, 1945-1951
• REZA, G. Chip scale package issues. Microelectronics Reliability. 2000, 40-7, 1157-1161
• JANNES, C. J. Reliability of electrically conductive adhesive joints for surface mount applications : A summary of the state of art. IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part A. 1998, 21-2, 215-225
• YIN, C. Y. The effect of relfow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability. 2003, 43-4, 625-633

Terms in the title (8)： 異方性 ,  樹脂接合 ,  フリップチップ ,  吸湿 ,  リフロー ,  試験 ,  はく離 ,  予測解析