The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

YIN C Y; ALAM M O; CHAN Y C; BAILEY C; LU H

Art

J-GLOBAL ID：200902227812811351 Reference number：03A0316285

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

フリップチップオンフレックス応用のための異方性導電膜相互接続の接触抵抗と信頼性におよぼすリフロー工程の効果

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Material：
Volume： 43 Issue： 4 Page： 625-633 Publication year： Apr. 2003
JST Material Number： C0530A ISSN： 0026-2714 Document type： Article
Article type：原著論文 Country of issue： United Kingdom (GBR) Language： ENGLISH (EN)

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Connecting parts , Manufacturing technology of solid-state devices

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