Art
J-GLOBAL ID：200902228103222837   Reference number：07A0844464

Advanced dicing technology for semiconductor wafer - Stealth dicing

半導体ウエハ用先端的ダイシング技術-ステルス・ダイシング
Author (6)：
KUMAGAI Masayoshi

About KUMAGAI Masayoshi

(Hamamatsu Photonics KK, Hamamatsu, JPN)

About Hamamatsu Photonics KK, Hamamatsu, JPN

, 
UCHIYAMA Naoki

About UCHIYAMA Naoki

(Hamamatsu Photonics KK, Hamamatsu, JPN)

About Hamamatsu Photonics KK, Hamamatsu, JPN

, 
OHMURA Etsuji

About OHMURA Etsuji

(Osaka Univ., Suita, JPN)

About Osaka Univ., Suita, JPN

, 
SUGIURA Ryuji

About SUGIURA Ryuji

(Hamamatsu Photonics KK, Hamamatsu, JPN)

About Hamamatsu Photonics KK, Hamamatsu, JPN

, 
ATSUMI Kazuhiro

About ATSUMI Kazuhiro

(Hamamatsu Photonics KK, Hamamatsu, JPN)

About Hamamatsu Photonics KK, Hamamatsu, JPN

, 
FUKUMITSU Kenshi

About FUKUMITSU Kenshi

(Hamamatsu Photonics KK, Hamamatsu, JPN)

About Hamamatsu Photonics KK, Hamamatsu, JPN


Material：
IEEE Transactions on Semiconductor Manufacturing  (IEEE Trans Semicond Manuf)

About IEEE Transactions on Semiconductor Manufacturing


Volume： 20  Issue： 3  Page： 259-265  Publication year： Aug. 2007 
JST Material Number： T0521A  ISSN： 0894-6507  CODEN： ITSMED  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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*cutting (machining)

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,...
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*dicing

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,...
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JST classification (1)：
JST classification
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Manufacturing technology of solid-state devices 
(NC03030V)

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半導体ウエハ

About 半導体ウエハ

, 
ダイシング

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