Art

J-GLOBAL ID：200902228103980847   Reference number：09A0996677

静電容量型小型傾斜角センサの作製

Author (5)： NODA DAIJI (兵庫県大 高度産科技研) ,  NISHIMOTO KAZUFUMI (兵庫県大 高度産科技研) ,  MIYAKE HIROAKI (兵庫県大 高度産科技研) ,  NISHIDA SATOSHI (ナノクリエート) ,  HATTORI TADASHI (兵庫県大 高度産科技研)
Material： 日本設備管理学会誌  (Journal of the Society of Plant Engineers Japan)
Volume： 21  Issue： 2  Page： 26-30  Publication year： Sep. 15, 2009 
JST Material Number： L3298A  ISSN： 0915-5023  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *MEMS ,  *micromachining ,  electroforming ,  X ray lithography ,  embossing (plastic working) ,  *tilt angle ,  *sensor ,  metal mold ,  plastics molding ,  electrostatic capacity ,  *hot embossing
Semi thesaurus term： *LIGA process

JST classification (2)： Manufacturing technology of solid-state devices  (NC03030V) ,  Measuring methods and instruments of length,area,cross section,volume,angle  (AD05020O)

Reference (5)：

• E. W. Beker, W. Ehrfeld, A. Maner, and D. Munchmeyer: “Fabrication of Microstructures with High Aspect Ratios and Great structural Heights by Synchrotron Radiation Lithography, Galvanoforming and Plastics Molding”, Microelectron. Eng., Vol.4, No.1, pp. 35-56(1986)
• K. Idei, H. Mekaru, H. Takeda, and T. Hattori: “Precise Micro Pattern Replication by Hot Embossing”, JSME International Journal, Vol.49, No.1, pp. 69-73(2006)
• H. Ueda, H. Ueno, K. Itoigawa, and T. Hattori: “Development of Micro Capacitive Inclination Sensor”, Proceedings of the IEEE 2006 International Symposium on Micro-Nano Mechatronics and Human Science, pp. 545-550(2006)
• M. Nagakubo, H. Suzuki, and T. Hattori: “Direct Bonding between Aluminum and Silicon by the Formation of Hydrogen of Bonds”, JSME International Journal Series A, Vol.40, No4, pp. 453-458(1997)
• K. Nishimoto, N. Ishizawa, H. Ueda, D. Noda and T. Hattori: “Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion”, Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol.2, No.2, pp. 197-202(2008)

Terms in the title (3)： 静電容量 ,  傾斜角センサ ,  作製