Preferential Copper Electrodeposition at Submicrometer Trenches by Consumption of Halide Ion.

HAYASE M; TAKETANI M; HATSUZAWA T; HAYABUSA K

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J-GLOBAL ID：200902231982625088 Reference number：03A0377703

Preferential Copper Electrodeposition at Submicrometer Trenches by Consumption of Halide Ion.

ハロゲン化物イオンの消耗によるサブミクロントレンチでの銅の優先電着

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Material：
Volume： 6 Issue： 6 Page： C92-C95 Publication year： Jun. 2003
JST Material Number： W1290A ISSN： 1099-0062 CODEN： ESLEF6 Document type： Article
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

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Electrochemical reaction , Electroplating , Manufacturing technology of solid-state devices

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