Art
J-GLOBAL ID：200902243338563436   Reference number：07A0739756

これだけは知っておきたい最新の配線・実装材料技術 Cu配線の現状と将来

Author (3)：
ONUKI JIN

About ONUKI JIN

(茨城大 工)

About 茨城大 工

, 
TASHIRO SUGURU

About TASHIRO SUGURU

(茨城大 工)

About 茨城大 工

, 
KHOO Khyou Pin

About KHOO Khyou Pin

(茨城大 工)

About 茨城大 工


Material：
金属  (Materials Science & Technology)

About 金属


Volume： 77  Issue： 8  Page： 837-841  Publication year： Aug. 01, 2007 
JST Material Number： F0157A  ISSN： 0368-6337  CODEN： KNZKA  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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*wiring

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,...
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Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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*copper interconnect

About copper interconnect

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (4)：
Terms in the title
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実装

About 実装

, 
Cu配線

About Cu配線

, 
現状

About 現状

, 
将来

About 将来


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