Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB

PAK Jun So; AOYAGI Masahiro; KIKUCHI Katsuya; KIM Joungho

Art

J-GLOBAL ID：200902256599733376 Reference number：06A0246772

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB

多層PCBにおけるスルーホール信号ビアへの電力/接地面の帯域阻止フィルタ効果

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=06A0246772&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=06A0246772&from=J-GLOBAL&jstjournalNo=L1370A") }}

Author (4)： , , ,
Material：
Volume： E89-C Issue： 4 Page： 551-559 Publication year： Apr. 01, 2006
JST Material Number： L1370A ISSN： 0916-8524 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=06A0246772&from=J-GLOBAL&jstjournalNo=L1370A") }}

Printed circuits , Noise measurement

Reference (9)：

PAK, J. S. 3 GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect. Proc. Electronic Components and Technology Conference, May 2003. 2003, 1017-1022
GU, Q. Modeling and analysis of vias in multilayered integrated circuits. IEEE Trans. Microw. Theory Tech. 1993, 41, 2, 206-214
ITO, R. RF modeling of vertical interconnection between power-ground plane combined with 2D TLM. Proc. Electrical Performance of Electronic Packaging, Oct. 2001. 2001, 339-342
NOVAK, I. Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination. IEEE Trans. Adv. Packag. 1999, 22, 3, 274-283
RADU, S. An investigation of PCB radiated emissions from simultaneous switching noise. Proc. IEEE Int. Symp. Electromagnetic Compatibility, Seattle, WA, Aug. 1999. 1999, 893-898

ｍore...

, , , ,

Return to Previous Page